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| Polymark Resin Systems | |
| Dexter Polymer Systems Division | ||
| Insulcast | ||
| Ferro Corporation | ||
| Emerson & Cuming | ||
| Lord Corporation | ||
| OxyChem Electronic Materials | ||
| Bondline Electronic Adhesives | ||
| Thermoset | ||
| Dow Corning | ||
| Epoxy Technology | ||
| Engineered Materials Systems, Inc. | ||
| Multicore Solders | ||
| Zymet, Inc. | ||
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